JPS626655B2 - - Google Patents
Info
- Publication number
- JPS626655B2 JPS626655B2 JP53138506A JP13850678A JPS626655B2 JP S626655 B2 JPS626655 B2 JP S626655B2 JP 53138506 A JP53138506 A JP 53138506A JP 13850678 A JP13850678 A JP 13850678A JP S626655 B2 JPS626655 B2 JP S626655B2
- Authority
- JP
- Japan
- Prior art keywords
- pick
- upper member
- tool
- pellet
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13850678A JPS5565441A (en) | 1978-11-09 | 1978-11-09 | Direct mounting |
GB7938261A GB2034613B (en) | 1978-11-09 | 1979-11-05 | Method and apparatus for mounting electronic components |
DE2944810A DE2944810C2 (de) | 1978-11-09 | 1979-11-06 | Montagekopf zum Montieren von elektronischen Bauteilen |
US06/277,013 US4381601A (en) | 1978-11-09 | 1981-06-24 | Apparatus for mounting electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13850678A JPS5565441A (en) | 1978-11-09 | 1978-11-09 | Direct mounting |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5565441A JPS5565441A (en) | 1980-05-16 |
JPS626655B2 true JPS626655B2 (en]) | 1987-02-12 |
Family
ID=15223716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13850678A Granted JPS5565441A (en) | 1978-11-09 | 1978-11-09 | Direct mounting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5565441A (en]) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57138596A (en) * | 1981-02-13 | 1982-08-26 | Shinkawa Seisakusho Kk | Compensator for position of die |
JPS57145394A (en) * | 1981-03-03 | 1982-09-08 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
JPS59111400A (ja) * | 1982-12-16 | 1984-06-27 | 松下電器産業株式会社 | 電子部品の実装装置 |
JPS59115600A (ja) * | 1982-12-23 | 1984-07-04 | 株式会社日立製作所 | 座付電子部品の組込用マシンハンド |
JPS5986299A (ja) * | 1983-10-04 | 1984-05-18 | 富士機械製造株式会社 | 電子部品の位置決め保持装置 |
EP0160094A4 (en) * | 1983-11-02 | 1988-06-16 | Brunswick Corp | TUNING DEVICE FOR HIGH FREQUENCY POWER APPARATUS. |
US4555623A (en) * | 1983-12-05 | 1985-11-26 | Irvine Sensors Corporation | Pre-amplifier in focal plane detector array |
JPS60194399U (ja) * | 1984-06-01 | 1985-12-24 | 富士機械製造株式会社 | チツプ吸着・位置決め装置 |
JPH0834363B2 (ja) * | 1986-07-28 | 1996-03-29 | 松下電器産業株式会社 | 電子部品の位置規正方法 |
JPH0346251A (ja) * | 1989-07-13 | 1991-02-27 | Fujitsu Ltd | 位置決め装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5622139B2 (en]) * | 1972-07-12 | 1981-05-23 | ||
JPS4979476A (en]) * | 1972-12-06 | 1974-07-31 | ||
JPS5548718B2 (en]) * | 1974-11-08 | 1980-12-08 | ||
JPS5220666U (en]) * | 1975-07-30 | 1977-02-14 | ||
JPS5325368A (en) * | 1976-08-23 | 1978-03-09 | Hitachi Ltd | Pellet attaching collet |
JPS53104859A (en) * | 1977-02-25 | 1978-09-12 | Fujitsu Ltd | Ic inserting mechanism |
US4151945A (en) * | 1977-12-08 | 1979-05-01 | Universal Instruments Corporation | Automated hybrid circuit board assembly apparatus |
JPS5537283A (en) * | 1978-09-08 | 1980-03-15 | Matsushita Electric Ind Co Ltd | Article shifter |
-
1978
- 1978-11-09 JP JP13850678A patent/JPS5565441A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5565441A (en) | 1980-05-16 |
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